Dicing frame
Achieving lightweight dicing frames!
We have developed a lightweight "IT Dicing Frame"! This product is a frame used in the dicing process (cutting process) of semiconductor wafers, supporting precise processing by securing the wafer. Compared to the conventional SUS frame weighing 300g (t=1.5mm), we have achieved a significant weight reduction to just 85g (t=2.0mm). This contributes to reducing the burden during transportation and lowering the load on equipment, thereby supporting work efficiency. If you are interested, please feel free to contact us. We also welcome inquiries for quotes. Please consult us regarding the provision of sample products!
- 企業：東郷産業 営業本部
- 価格：Other
